# Galvanizing

## Notes from Jakob (may need refinement)

- copper sulphate
- solution a (copper sulphate)
- solution b
- solution c: caustic soda and formaldehyde

heating plate
- medium to be electroplated

- monodistilled (once distilled) water

- fill with water
- heating plate underneath (with magnetic stirrer)
- put thermometer (sensor) on top
- heat to 50 degrees
- add ingredients according to recipe in order. 
- todo: translate recipe


pre-treatment of plate
- hso degreaser
- caustic soda and disodium tasylate plus something like fit
    - degrease
- this forms very small oxide layers. we want to rinse these off
- rinse (with water)

- put the piece in solution
- how thick should the layer be?
- 3 to 8 μm per hour
- the bath is set to slow. why? because the bath is there to do selective coating. that means you want to coat one part and not others.
- 3d printed circuit boards can also be made with it. can be injection molded and then coated in electroplating
- 3d plastic: copper particles in plastic. expose with a laser and electroplate.
    - 3d mid
- process only works because there is a bit of copper on the surface. the copper acts as a catalyst.

if i now want to electroplate a sheet, i have to dip it in a solution beforehand so that a metal layer is deposited on it.
- the following would be possible:
    - palladium, silver etc. the only question is how to get it onto the surface
- we use palladium because it's a very good catalyst. it's a very good catalyst because it can be plated with

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[ECG10_ChemMet_20141022.pdf](https://unikat-ilmenau.de/wiki/attachments/20)  
[Presol 1-3_TDS.pdf](https://unikat-ilmenau.de/wiki/attachments/21)  
[ENPLATE CU 872.pdf](https://unikat-ilmenau.de/wiki/attachments/22)