Galvanizing

Notes from Jakob (may need refinement)

• copper sulphate
• solution a (copper sulphate)
• solution b
• solution c: caustic soda and formaldehyde

heating plate

• medium to be electroplated

• monodistilled (once distilled) water

• fill with water

• heating plate underneath (with magnetic stirrer)

• put thermometer (sensor) on top

• heat to 50 degrees

• add ingredients according to recipe in order.

• todo: translate recipe

pre-treatment of plate

• hso degreaser

• caustic soda and disodium tasylate plus something like fit

  • degrease

• this forms very small oxide layers. we want to rinse these off

• rinse (with water)

• put the piece in solution

• how thick should the layer be?

• 3 to 8 μm per hour

• the bath is set to slow. why? because the bath is there to do selective coating. that means you want to coat one part and not others.

• 3d printed circuit boards can also be made with it. can be injection molded and then coated in electroplating

• 3d plastic: copper particles in plastic. expose with a laser and electroplate.

  • 3d mid

• process only works because there is a bit of copper on the surface. the copper acts as a catalyst.

if i now want to electroplate a sheet, i have to dip it in a solution beforehand so that a metal layer is deposited on it.

• the following would be possible:
  • palladium, silver etc. the only question is how to get it onto the surface
• we use palladium because it's a very good catalyst. it's a very good catalyst because it can be plated with

ECG10_ChemMet_20141022.pdf
Presol 1-3_TDS.pdf
ENPLATE CU 872.pdf